lsd235/62-xx doc. no : qw0905- rev. : a date : - 2006 lsd235/62-xx data sheet single digit led display (0.28 inch) ligitek electronics co.,ltd. property of ligitek only pb lead-free parts 23 - may
note : 1.all dimension are in millimeters and (lnch) tolerance is page 1/8 ligitek electronics co.,ltd. property of ligitek only 12.9 2.54x4= 10.16 (0.4") 7.0 l s d 2 3 5 / 6 2 - x x l i g i t e k 7.62 (0.3") 0.45 typ. 4.0
ligitek electronics co.,ltd. property of ligitek only internal circuit diagram part no. 2/8 page lsd2352-xx 3,8 10 10 lsd2362-xx 3,8 9 74 2 5 b a c e d f 1 g 7 92 4 5 b a c e d f 1 g lsd235/62-xx
2 cathode f 2 anode f cathode d cathode c common cathode anode b anode a anode c common cathode anode d no pin anode e 7 10 8 9 5 6 3 4 7 cathode a 10 common anode cathode b 8 9 no pin 6 5 common anode cathode e 4 3 cathode g ligitek electronics co.,ltd. property of ligitek only anode g electrical connection part no. 1 pin no.1lsd2352-xx 1 pin no.1 3/8 page lsd2362-xx lsd235/62-xx
! -25 ~ +85 tstg storage temperature note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. solder temperature 1/16 inch below seating plane for 3 seconds at 260 ! " p ( nm) part selection and application information(ratings at 25) gap material lsd2352-xx part no common cathode common anode green common cathode or anode emitted chip electrical max. min. #" (nm) typ. vf(v) iv-m min. typ. iv(mcd) peak forward current per chip (duty 1/10,0.1ms pulse width) power dissipation per chip operating temperature reverse current per any chip t opr pd ir forward current per chip parameter i fp i f symbol -25 ~ +85 100 10 ! $ a mw 120 30 ratings g ma ma unit p ligitek electronics co.,ltd. property of ligitek only absolute maximum ratings at ta=25 ! part no.page4/8 lsd2362-xx gap green 56530 1.7 1.35 2.1 2.62.35 2:1 lsd235/62-xx
symbol #" iv-m spectral line half-width reverse current any chip luminous intensity matching ratio parameter luminous intensity per chip peak wavelength forward voltage per chip ir $ a nm vr=5v if=20ma iv " p vf mcd nm volt unit if=10ma if=20ma if=20ma test condition test condition for each parameter part no. ligitek electronics co.,ltd. property of ligitek only page 5/8 lsd235/62-xx
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ! ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 ! fig.4 relative intensity vs. temperature ambient temperature( ! ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 ! typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) page forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 500550600650 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 3.5 g chip part no. 6/8 lsd235/62-xx
dip soldering preheat: 120 ! c max preheat time: 60seconds max ramp-up 2 ! c/sec(max) ramp-down:-5 ! c/sec(max) solder bath:260 ! c max dipping time:3 seconds max distance:solder temperature 1/16 inch below seating plane for 3 seconds at 260 ! c 260 ! c3sec max preheat 60 seconds max 25 % 0 % 0 120 % 2 ! /sec max 50 temp( ! c) 260 % 5 ! /sec max 100 time(sec) 150 soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 ! c max soldering time:3 seconds max(one time) distance:solder temperature 1/16 inch below seating plane for 3 seconds at 260 ! c 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only lsd235/62-xx part no. page 7/8
the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. 1.ta=105 ! 5 ! &-40 ! 5 ! (10min) (10min) 2.total 10 cycles mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 solderability test solder resistance test this test intended to see soldering well performed or not. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. 1.t.sol=230 ! 5 ! 2.dwell time=5 1sec 1.t.sol=260 ! 5 ! 2.dwell time= 10 1sec. mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 ligitek electronics co.,ltd. property of ligitek only the purpose of this test is the resistance of the device under tropical for hours. reliability test: high temperature high humidity test thermal shock test low temperature storage test high temperature storage test operating life test test item the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=10ma 3.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) test condition this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. description part no. mil-std-202:103b jis c 7021: b-11 jis c 7021: b-12 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 mil-std-883:1008 jis c 7021: b-10 reference standard page8/8 lsd235/62-xx
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